chip n. 1.碎片,削片,薄片;碎屑;薄木片;無價(jià)值的東西。 2.(陶器等的)缺損(處)。 3.(賭博用)籌碼;〔pl.〕〔英俚〕錢。 4.〔pl.〕〔口語〕炸馬鈴薯片。 5.(作燃料的)干牛[馬]糞。 6.集成電路唱片[塊]。 7.〔口語〕小粒金剛石[水晶]。 a chip of [off] the old block (脾氣等)完全像父親的兒子;一家的典型人物。 (as) dry as a chip 枯燥無味的。 buy chips 投資。 cash [pass] in one's chips 把籌碼兌現(xiàn);〔俚語〕死。 chip in porridge [pottage, broth] 無關(guān)重要的東西,可有可無的東西。 do not care a chip for 毫不介意。 have a chip on one's shoulder 〔美俚〕盛氣凌人;好打架;好爭吵。 have one's chips on 孤注一擲。 in the chips 〔美俚〕有錢的。 let the chips fall where they may 不管后果如何。 when the chips are down [get on the line] 萬不得已的時(shí)候,緊急時(shí)候。 vt. (-pp-) 1.切,削,鑿,刻。 2.把…削成薄片;弄缺(刀口,瓷器等)。 3.〔口語〕戲弄;挖苦。 4.(雞雛等)啄碎(蛋殼)。 vi. 1.出現(xiàn)缺口。 2.碎裂,瓦解,破碎 (off)。 chip at 對準(zhǔn)…打,謾罵。 chip in 〔口語〕插嘴,加入(打架等);捐助;拿錢賭 (They all chipped in to buy it. 大家都要買了)。 chip off 切下來,削下來。 n. (摔跤時(shí))用絆腿把對方摔倒的一種技巧。 vt. (-pp-) (用絆腿)摔倒(對方)。
architecture n. 1.建筑學(xué)。 2.建筑(樣式、風(fēng)格);建筑物。 3.構(gòu)造,結(jié)構(gòu);【自動化】(電子計(jì)算機(jī)的)架構(gòu),體系結(jié)構(gòu)。 civil architecture 民用建筑。 domestic architecture 住宅建筑。 naval architecture 造船術(shù),造船學(xué)。 the architecture of a beehive 蜂窩的結(jié)構(gòu)。
Processor _ architecture : lists the processor ' s chip architecture 列出了處理器的芯片架構(gòu)。
The name of the common chip architecture for ibms pseries and iseries servers Ibm的pseries和iseries服務(wù)器通用芯片體系結(jié)構(gòu)的名字。
Integration of software - based system - on - a - chip architectures with " 4g " networks is anticipated in the next few years 整合軟體系統(tǒng)晶片結(jié)構(gòu)以4g網(wǎng)路是被期望在什麼時(shí)候
E : integration of software - based system - on - a - chip architectures with " 4g " networks is anticipated in the next few years 整合軟體系統(tǒng)晶片結(jié)構(gòu)以4g網(wǎng)路是被期望在什麼時(shí)候
In this survey we explore the hardware aspects of reconfigurable computing machines , from single chip architecture to multichip systems , including internal structure and external coupling 在某一時(shí)刻一條指令執(zhí)行過程中整個(gè)處理器的部件都服務(wù)于盡快完成這條指令,至少在概念上如此。
The pssc superchip , a single - chip implementation of the power2 s eight - chip architecture , powered the 32 - node ibm deep blue supercomputer that beat world champion garry kasparov at chess in 1997 Pssc超級芯片是power2這種8芯片體系結(jié)構(gòu)的一種單片實(shí)現(xiàn),使用這種芯片配置的一個(gè)32節(jié)點(diǎn)的ibm深藍(lán)超級計(jì)算機(jī)在1997年擊敗了國際象棋冠軍garry kasparov 。
In terms of reliability , another advantage of this approach is that if copies of the sub - job are sent to machines with different architectures , we can protect ourselves against potential errors introduced by a chip architecture , operating system or compiler 從可靠性來講,這種方法的另外一個(gè)優(yōu)點(diǎn)是,如果子任務(wù)的不同拷貝被發(fā)送到不同架構(gòu)的機(jī)器上,我們就可以避免由于一種芯片架構(gòu)、操作系統(tǒng)或編譯器而引起的潛在錯(cuò)誤。
10 wallner s . a configurable system - on - chip architecture for embedded devices . in ninth asia - pacific computer systems architecture conference acsac 2004 , beijing , china , springer , lncs 3189 , sept . 7 - 9 , 2004 , pp . 58 - 71 . 11 wallner s . design methodology of a configurable system - on - chip architecture 它結(jié)合了大量的宏模塊資源,包括一個(gè)類標(biāo)量處理器內(nèi)核粗粒度可配置的處理陣列嵌入式的存儲器,以及由微任務(wù)控制器mtc監(jiān)控的定制模塊。
At light loads , the architecture allows the chip to “ skip ” cycles to reduce power dissipation . in the circuit design , the basic principle and small signal model of the boost power stage are given at first , and then the stability and small signal model of the control loop are also analyzed , finally , the whole chip architecture and sub - block parameters are presented according to the application requirements 在電路設(shè)計(jì)中,首先闡述了升壓型直流轉(zhuǎn)換器的功率輸出級的拓?fù)浣Y(jié)構(gòu)、基本原理、小信號模型,然后分析了電流模式控制回路的穩(wěn)定性及小信號模型,最后根據(jù)應(yīng)用要求進(jìn)行了電路的總體架構(gòu)設(shè)計(jì),完成了每個(gè)子電路的各種參數(shù)的分析、計(jì)算。
The chip is accomplished in the full cooperation with other team members , the author pays particular attention to the analysis of the whole chip architecture and three sub - block design : transconductance amplifier ( ota ) , voltage reference and current reference . based on existed technologies , a new high order temperature compensated voltage reference and a creative current reference with high order temperature compensation are shown respectively . the author simulated all the sub - block and whole chip by hspice 該芯片的設(shè)計(jì)是由小組成員共同完成,本人主要負(fù)責(zé)了總體電路的分析、聯(lián)合仿真驗(yàn)證及以下三個(gè)子電路的設(shè)計(jì): 1 、跨導(dǎo)放大器,詳細(xì)分析了bandgap跨導(dǎo)放大器輸入級的動靜態(tài)特性及其優(yōu)缺點(diǎn),并結(jié)合系統(tǒng)要求,設(shè)計(jì)了一種與cmos工藝相兼容、可替代bandgap跨導(dǎo)放大器的低壓共源共柵跨導(dǎo)放大器。